[UCI-Calit2] Reminder: Ultra-thin Chips -- a New Paradigm in Silicon Technology

Anna Lynn Spitzer aspitzer at calit2.uci.edu
Wed Feb 11 13:20:59 PST 2009


REMINDER: Calit2 at UCI and IEEE Orange County EDS/MTT (Electron Devices
Society/Microwave Theory and Techniques Society) Joint Chapter Present
an EDS Distinguished Lecturer

 

 

Title:          Ultra-thin Chips - a New Paradigm in Silicon Technology

 

Speaker:        Joachim N. Burghartz, Institute for

                Microelectronics Stuttgart (IMS CHIPS), professor at 

                University of Stuttgart and IEEE Fellow

 

Time:           10 a.m.            

 

Date:           Friday, Feb. 13, 2009    

 

Location:       Calit2 Building, Room 3008

 

Abstract:    In contrast to conventional thick silicon chips, ultra-thin
chips will be the basis for new applications, such as 3D integrated
circuits (3D-ICs) and systems-in-foil (SiF). This talk will introduce
and compare two generically different process technologies that can be
exploited for the fabrication of ICs on extremely thin chips.
Furthermore, several application results and demonstrations will be
presented and discussed based on material that has been presented at
recent IEDM and ISSCC conferences.

 

Bio:    Joachim N. Burghartz is an IEEE Fellow, an IEEE Distinguished
Lecturer, and an AdCom member of the IEEE Electron Devices Society. He
received his MS degree from RWTH Aachen in 1982 and his PhD degree in
1987 from the University of Stuttgart, both in Germany. From 1987-1998
he was with the IBM T. J. Watson Research Center in Yorktown Heights,
New York, where he was engaged in early development of SiGe HBT
technology and later, in the integration of passive components,
particularly inductors, for application to monolithic RF circuits. From
1998-2005 he was a professor at TU Delft in the Netherlands, serving as
scientific director of Delft research institute DIMES from 2001-2005. In
fall 2005, he moved to Stuttgart, Germany, to head the Institute for
Microelectronics Stuttgart (IMS CHIPS). In addition, he is affiliated
with the University of Stuttgart as a full professor. Burghartz has
published more than 250 reviewed articles and holds approximately 30
patents.

 

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